A PRE-ENCAPSULATED LEAD FRAME STRUCTURE WITH ISLAND AND MANUFACTURING METHOD

摘要

A method is provided for manufacturing a lead frame structure (100) in a semiconductor packaging process. The method includes providing a metal substrate having a top surface and a back surface, forming a top surface etching pattern and a back surface etching pattern. The method also includes performing an etching process to form an island (1) and a plurality of leads (2). Outer leads of the plurality of leads (2) on the back surface extend to the proximity of the island (1) such that a length of the outer leads is greater than a length of inner leads of the plurality of leads (2) on the top surface by a predetermined amount. Further, the method includes encapsulating the etched metal substrate using a molding compound exposing top surfaces and back surfaces of the island (1) and the plurality of leads (2).