| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package and a semiconductor device which are capable of preventing the occurrence of a failure due to heat. <P>SOLUTION: A semiconductor package 1 of the present invention comprises: a wiring board 2 including a substrate 21, a conductor pattern 221 provided on one surface side of the substrate 21, and a conductor pattern 224 provided on the other surface side of the substrate 21 and electrically connected to the conductor pattern 221; a semiconductor element 3 bonded to one surface of the substrate 21 and electrically connected to the conductor pattern 221; and a first reinforcing member 4 bonded to that portion of a surface on the semiconductor element 3 side of the substrate 21 to which the semiconductor element 3 is not bonded, and having a smaller thermal expansion coefficient than the substrate 21. The conductor pattern 221 is provided with a plurality of terminals 221b. The first reinforcing member 4 has a plate shape. In the first reinforcing member 4, a plurality of through holes 42 which are provided corresponding to the terminals 221b and penetrate the first reinforcing member 4 in the thickness direction are formed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
