| 摘要 |
A semiconductor package includes a first structural body having a first surface and a second surface which faces away from the first surface, and formed with first connection members on the first surface; a second structural body placed over the first structural body, and formed with second connection members on a surface thereof which faces the first surface of the first structural body; and an interposer interposed between the first structural body and the second structural body, and having a body which is formed with openings into which the first connection members and the second connection members are inserted and a conductive layer which is formed to fill the openings.
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