发明名称 METHOD OF FORMING AN ETCH MASK
摘要 A method of forming an etch mask includes: providing a substrate having thereon a material layer to be etched; forming a hard mask layer consisting of a radiation-sensitive, single-layer resist material on the material layer; exposing the hard mask layer to actinic energy to change solvent solubility of exposed regions of the hard mask layer; and subjecting the hard mask layer to water treatment to remove the exposed regions of the hard mask layer, thereby forming a masking pattern consisting of unexposed regions of the hard mask layer.
申请公布号 US2013071790(A1) 申请公布日期 2013.03.21
申请号 US201113233039 申请日期 2011.09.15
申请人 HUANG TSE-YAO;CHEN YI-NAN;LIU HSIEN-WEN 发明人 HUANG TSE-YAO;CHEN YI-NAN;LIU HSIEN-WEN
分类号 G03F7/20 主分类号 G03F7/20
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