发明名称 |
MULTI-LAYER WIRING SUBSTRATE, ACTIVE MATRIX SUBSTRATE, IMAGE DISPLAY APPARATUS USING THE SAME, AND MULTI-LAYER WIRING SUBSTRATE MANUFACTURING METHOD |
摘要 |
A multiple-layer wiring substrate having a first conductive layer; an interlayer insulating layer; and a second conductive layer is disclosed, wherein the interlayer insulating layer includes a material whose surface energy is changed by receiving energy, and has a first region which does not include a contact hole and a second region which is formed such that its surface energy is higher than that of the first region, wherein a region within the contact hole of the first conductive layer has surface energy which is higher than surface energy of the second region of the interlayer insulating layer, and wherein the second conductive layer is formed by laminating, wherein the second conductive layer is in contact with the second region of the interlayer insulating layer along the second region, and is connected to the first conductive layer via the contact hole. |
申请公布号 |
US2013069087(A1) |
申请公布日期 |
2013.03.21 |
申请号 |
US201213613938 |
申请日期 |
2012.09.13 |
申请人 |
ONODERA ATSUSHI;SUZUKI KOEI;MIURA HIROSHI;TANO TAKANORI;RICOH COMPANY, LTD. |
发明人 |
ONODERA ATSUSHI;SUZUKI KOEI;MIURA HIROSHI;TANO TAKANORI |
分类号 |
H05K1/11;H01L29/78;H01L33/08;H05K3/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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