发明名称 |
HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND METHOD OF MAKING THE SAME |
摘要 |
The integrated circuit packaging techniques of the disclosed embodiments utilize a thermally conductive heat sink to partially enclose an integrated circuit. The heat sink is separated from the integrated circuit by a substrate that is conformally positioned into a recess in the heat sink, enabling the heat sink to transfer thermal energy from the integrated circuit. |
申请公布号 |
US2013069218(A1) |
申请公布日期 |
2013.03.21 |
申请号 |
US201113237694 |
申请日期 |
2011.09.20 |
申请人 |
SEAH LEE HUA ALVIN;STMICROELECTRONICS ASIA PACIFIC PTE LTD. |
发明人 |
SEAH LEE HUA ALVIN |
分类号 |
H01L23/34;H01L21/52;H01L21/56 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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