| 摘要 |
PURPOSE: An apparatus for polishing a sapphire wafer and an ingot is provided to reduce processing time by simultaneously polishing the sapphire wafer and the ingot. CONSTITUTION: A platen(120) mounts a polishing pad on the upper side thereof and rotates. A head part(130) is selectively operated when a wafer is processed, and pressurizes the wafer mounted on the lower side thereof to the polishing pad. The head part maintains a non-contact state with an ingot when the ingot is polished. A jig(140) for polishing the ingot is selectively operated when the ingot is processed, and fixes the ingot to the polishing pad to polish the ingot by contacting with the polishing pad using the load of the ingot. |
