WIRE SAW DEVICE AND WORKPIECE CUTTING METHOD, AND METHOD FOR MANUFACTURING WAFER

摘要

PROBLEM TO BE SOLVED: To cut a workpiece quickly by using both loose abrasive grains and fixed abrasive grains to improve capability to cut a workpiece (cutting performance).

SOLUTION: The fixed abrasive grains 23 and the loose abrasive grains 21 are both used. The loose abrasive grains 21 have an average grain diameter of 1 μm or larger and smaller than that of the fixed abrasive grains 23, or of 1 μm or larger and within the range of an average protrusion amount of the fixed abrasive grains 23 or smaller. This allows both the loose abrasive grains 21 and the fixed abrasive grains 23 to reliably act to cut a workpiece 7 with the fixed abrasive grains 23 serving mainly and without the loose abrasive grains 21 disturbing the cutting by the fixed abrasive grains 23.

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