发明名称 SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
摘要 <p>Provided is a sputtering target having high electrical conductivity and capable of forming a WOx film by DC sputtering. Also provided is a method for producing the sputtering target. This sputtering target is a sintered body of tungsten oxide having a structure comprising at least two phases including a WO2 phase and a W18O49 phase, wherein the percentage of the WO2 phase in the structure is 5% or higher. The method for producing said sputtering target involves a step of preparing a tungsten oxide powder containing WO2 and at least one of W18O49 and WO3, and a step of sintering the tungsten oxide powder in a vacuum by hot pressing to produce a sintered body of tungsten oxide, wherein the content of said WO2 in said tungsten oxide powder is 5-95 mol%.</p>
申请公布号 WO2013039251(A1) 申请公布日期 2013.03.21
申请号 WO2012JP73961 申请日期 2012.09.11
申请人 MITSUBISHI MATERIALS CORPORATION;UMEMOTO, KEITA;ZHANG, SHOUBIN 发明人 UMEMOTO, KEITA;ZHANG, SHOUBIN
分类号 C23C14/34;C04B35/00 主分类号 C23C14/34
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