| 摘要 |
<p>Provided is a semiconductor module which can be connected by means of simple wiring. A semiconductor device of the semiconductor module has: a semiconductor substrate; a first electrode formed on one surface of the semiconductor substrate; and a second electrode formed on a semiconductor substrate surface on the reverse side of the one surface. The semiconductor module has: a first electrode plate in contact with the first electrode; a second electrode plate in contact with the second electrode; and a first wiring member, which penetrates the first electrode plate by being insulated from the first electrode plate, and is connected to the second electrode plate. The first electrode plate, the semiconductor device, and the second electrode plate are fixed to each other by having pressure applied to the first electrode plate and the second electrode plate, said pressure pressuring the semiconductor device.</p> |
