SOCKET DEVICE FOR TESTING A IC PACKAGE

摘要

PURPOSE: A socket apparatus for a semiconductor package test is provided to pressurizes a contact pin in a transverse direction by an up and down driving of a working body portion, and implement an electrical contact by contacting the contact pin to the side bottom part of a solder ball center and a wiping action. CONSTITUTION: A plurality of contact pins(500) is corresponded to each solder ball of a semiconductor package(10) on a one-to-one basis. The bottom part of the contact pin is inserted into a fixing body portion(100). The upper part of the contact pin is inclined and located toward the solder ball. The contact pin is pressurized in a transverse direction by a downward movement of the semiconductor package which is pressurized by a latch(400) and an upward movement of a working body portion(600). Therefore, the solder ball of the contact pin and the semiconductor package is contacted.