| 摘要 |
Adhesive composition curable by heating, comprises: 20-85% of a polyether (A) comprising two terminal groups of hydrolyzable alkoxysilane type, having a viscosity measured at 23[deg] C of 25-40 Pa.s; 15-80% of a compatible tackifying resin (B) having number average molecular weight of 200-10 kDa; and 0.01-3% of a crosslinking catalyst (C). Adhesive composition curable by heating, comprises: 20-85% of a polyether of formula ((R1O) 3 - p(R2) pSi-R3-NH-C(=O)-[OR4] n-O-C(=O)-NH-R3-Si(R2) p(OR1) 3 - p) (A) comprising two terminal groups of hydrolyzable alkoxysilane type, having a viscosity measured at 23[deg] C of 25-40 Pa.s; 15-80% of a compatible tackifying resin (B) having number average molecular weight of 200-10 kDa; and 0.01-3% of a crosslinking catalyst (C). R1, R2 : 1-4C alkyl, with the possibility when there is more R1 or R2 groups present then they are identical or different; R3 : 1-6C divalent linear alkylene; R4 : 1-4C divalent linear or branched alkylene; n : the number average molecular weight (Mn) of the polymer (A) i.e. 20-40 kDa; and p : 0-2. An independent claim is included for self-adhesive backing that can be obtained by the method comprising: (a) preheating the adhesive composition at 50-130[deg] C, (b) a coating on a support layer, and (c) crosslinking by heating the substrate and coating at 50-150[deg] C. |
