SUBSTRATE COOLING DEVICE, SUBSTRATE COOLING METHOD AND HEAT TREATMENT APPARATUS

摘要

PURPOSE: A device and a method for cooling a substrate and a heat treatment apparatus are provided to reduce cooling time by carrying a substrate support member to an air cooling port. CONSTITUTION: A substrate support member(15) holds substrates. A heat shielding member(30) is inserted between the substrate support member and a heater(12). An air cooler port(21) is arranged outside the heat shielding member and a process chamber(11). The heat shielding member is separable from a half cylindrical member(31).