| 摘要 |
<p>A bonding apparatus and a bonding system are provided with a first holding member for sucking and holding a chip at a lower end of a temporarily press-bonding head, and a second holding member for sucking and holding an FPC. The first holding member sucks and holds the entire surface or a part of a chip component, and the second holding member covers the entire surface of the FPC and sucks and holds at least corner sections. In the bonding system, the chip or/and FPC are sucked and held by operating at least either the first or the second holding member by permitting a control section to switch an electromagnetic valve, corresponding to a transferred mounting member.</p> |
