发明名称 |
Wiring board and method for manufacturing the same |
摘要 |
A wiring board has a first rigid wiring board having an accommodation section, a second rigid wiring board to be accommodated in the accommodation section, and an insulation layer formed on the first rigid wiring board and the second rigid wiring board. Here, a conductor of the first rigid wiring board and a conductor of the second rigid wiring board are electrically connected to each other, and at least either a side surface of the second rigid wiring board or a wall surface of the accommodation section has a concave-convex portion. |
申请公布号 |
US8400782(B2) |
申请公布日期 |
2013.03.19 |
申请号 |
US20100694660 |
申请日期 |
2010.01.27 |
申请人 |
AOYAMA MASAKAZU;NOGUCHI HIDETOSHI;IBIDEN CO., LTD. |
发明人 |
AOYAMA MASAKAZU;NOGUCHI HIDETOSHI |
分类号 |
H05K1/11;H05K1/03;H05K1/16 |
主分类号 |
H05K1/11 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|