| 摘要 |
A semiconductor assembly with an integrated circuit (IC) and a companion device. An exemplary semiconductor assembly includes a printed circuit board (PCB) and first and second ICs. The PCB has first contacts on a top surface and second contacts on a bottom surface. The first contacts are vertically aligned with the second contacts and are electrically coupled by vias in the PCB. The first IC has first terminals respectively coupled to the first contacts of the PCB, the first terminals including first input/output (IO) terminals. The second IC includes at least one die, and second terminals coupled to at least a portion of the second contacts of the PCB. The second terminals include second IO terminals of the companion die, and are respectively coupled to those of the second contacts that are vertically aligned with those of the first contacts respectively coupled to the first IO terminals.
|
