METHOD OF MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD PREPARED BY THE SAME

摘要

PURPOSE: A circuit board and a manufacturing method thereof are provided to prevent the etching defect of a circuit pattern by forming a bump later after forming a micro circuit pattern first. CONSTITUTION: A second insulation layer(232) is formed in an area except a bump(222). The outer surface of the second insulation layer is formed to be flat against the outer surface of the bump materially. A third insulation layer is formed on the first insulation layer. A second conductive layer is formed on the outer surface of the third insulation layer. The second conductive layer equips with a second circuit pattern.