LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE PACKAGE

摘要

PURPOSE: A light emitting device and a light emitting device package including the same are provided to improve hole injection efficiency by spreading a fluorescent substance on a light emitting chip. CONSTITUTION: A second conductive semiconductor layer(123) is formed on a first conductive semiconductor layer(117). An active layer(119) is arranged between the first conductive semiconductor layer and the second conductive semiconductor layer. The active layer includes well layers(W1-W3) and barriers(B1-B4).