| 发明名称 |
Method for packaging electronic devices and integrated circuits |
| 摘要 |
The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic devices and to the packaging of electronic devices and their associated driver and/or controller integrated circuits. |
| 申请公布号 |
US8399293(B2) |
申请公布日期 |
2013.03.19 |
| 申请号 |
US201113231844 |
申请日期 |
2011.09.13 |
| 申请人 |
LEIB JUERGEN;YAMAMOTO HIDEFUMI;WAFER-LEVEL PACKAGING PORTFOLIO LLC |
发明人 |
LEIB JUERGEN;YAMAMOTO HIDEFUMI |
| 分类号 |
H01L21/00;H01L23/495 |
主分类号 |
H01L21/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
