发明名称 Optical device package
摘要 An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed portion. The structure can be a lid or a frame to which a lid is bonded. An optical fiber is positioned within at least one of the proximal longitudinally extending notch and the distal longitudinally extending notch and within the recessed portion of the structure mounted to the substrate. The optical device package can also include conductive legs extending upwardly from bonding pads on the upper surface of the substrate to facilitate flip mounting of the optical device package onto a circuit board or other such platform.
申请公布号 US8399897(B2) 申请公布日期 2013.03.19
申请号 US20060503023 申请日期 2006.08.11
申请人 SHERRER DAVID W.;DAUTARTAS MINDAUGAS F.;RICKS NEIL;STEINBERG DAN A.;SAMSUNG ELECTRONICS CO., LTD. 发明人 SHERRER DAVID W.;DAUTARTAS MINDAUGAS F.;RICKS NEIL;STEINBERG DAN A.
分类号 H01L33/00;G02B6/30;G02B6/36;G02B6/42 主分类号 H01L33/00
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