发明名称 |
Non-leaded integrated circuit package system |
摘要 |
A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including outer terminal pads and inner terminal pads, and selectively fusing an extension between the die paddle and instances of the inner terminal pads. |
申请公布号 |
US8399968(B2) |
申请公布日期 |
2013.03.19 |
申请号 |
US20050164335 |
申请日期 |
2005.11.18 |
申请人 |
PUNZALAN JEFFREY D.;BATHAN HENRY D.;SHIM IL KWON;STATS CHIPPAC LTD. |
发明人 |
PUNZALAN JEFFREY D.;BATHAN HENRY D.;SHIM IL KWON |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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