| 摘要 |
PURPOSE: An etching solution for copper and copper alloy is provided to improve practicality by increasing an etching rate according to the increase of a spray flow rate and to obtain a fair cross-sectional shape even with the use of a dipping or spraying type. CONSTITUTION: An etching solution for copper and copper alloy is for etching the laminated membrane of a metal which contains copper layer, copper oxide layer, or copper alloy layer excluding the alloy of copper and molybdenum, copper and titanium, and copper and chrome. The etching solution includes 0.1-80wt% of persulfate solution or persulfuric acid solution, 0.1-80wt% of phosphoric acid, and 0.1-50wt% of nitric or sulfuric acid. The persulfate solution contains peroxo monosulfuric acid potassium, peroxy acid potassium sulfate, and peroxodisulfuric acid ammonium or potassium peroxodisulfate with one, two, or more kinds. The persulfate solution or persulfuric acid solution contains the peroxy acid potassium sulfate. The persulfuric acid solution contains peroxo monosulfuric acid potassium, peroxy acid potassium sulfate, and peroxodisulfuric acid ammonium or potassium peroxodisulfate with one, two, or more kinds and 0.001-5wt% of active oxygen. [Reference numerals] (AA) LD100:11.7 weight%; (BB) H_2SO_4 (weight%); (CC) H_3PO_4 (weight%)
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