LASER PROCESSING METHOD AND LASER PROCESSING MACHINE

摘要

The disclosed laser processing method involves a first processing step for irradiating a workpiece from the direction of a main surface (20A) of said workpiece with a laser (L) at a first energy density to form a surface hole (HA) extending to an intermediate position in the thickness direction of said workpiece, and a second processing step for forming a through-hole by irradiating the position of the surface hole (HA) from the direction of the back surface (20B) (the other main surface) of the workpiece with a laser (L) at a second energy density and forming a back hole (HB) at a position behind the front hole (HA), wherein the second energy density is set to a higher level than the first energy density.