APPARATUS FOR BONDING SUBSTRATES

摘要

PURPOSE: A substrate bonding apparatus is provided to improve direct bonding efficiency by transmitting a uniform load to two substrates. CONSTITUTION: A support unit(110) supports a silicon substrate(10) and a GaN substrate(20) and is transformed to contact the silicon substrate. The support unit includes a support unit body(111) with a first concave part(111a), a first floating layer(112), and a first flexible thin film layer(113). A pressurizing unit(120) reciprocates toward the support unit to apply a bonding load to the silicon substrate and the GaN substrate. The pressurizing unit is transformed to contact the GaN substrate. The pressurizing unit includes a support body(121) with a second concave part(121a), a second floating layer(122), and a second flexible thin film layer(123).