| 摘要 |
PURPOSE: A flexible metal laminate containing a fluorine resin is provided to easily apply a metal laminate with a low permittivity to a printed circuit board. CONSTITUTION: A flexible metal laminate includes a first metal layer, a first polyimide layer, a polyimide layer on the first polyimide layer, and a second polyimide layer on the polyimide layer. A fluorine resin is dispersed in the polyimide layer. In the entire thickness of the polyimide layer, a fluorine resin content per unit volume in 5 to 10% of the depth from the surface of the polyimide layer is lower than a content per unit volume in 40 to 60% of the depth of from the surface of the polyimide layer. The fluorine resin content per unit volume in 5 to 10% of the depth from the surface of the polyimide layer is the lowest in the entire thickness of the polyimide layer. The laminate further includes a second metal layer on the second polyimide layer. The ten point average roughness(Rz) of the surfaces of the first and the second metal layers are respectively 0.5 to 2.5um. The thicknesses of the first and the second polyimide layers are respectively 1 to 10um. The thickness of the polyimide layer is 5 to 50um. The fluorine resin is at least one selected from a group of polytetrafluoroethylene(PTFE), perfluoroalkoxy(PFA), fluorinated ethylene propylene(FEP), chlorotrifluoroethylene (CTFE), tetrafluoroethylene/chlorotrifluoroethylene (TFE/CTFE), ethylene chlorotrifloroethylene(ECTFE), and polyfluorine vinylidene(PVDF). The polyimide layer includes 10 to 60 wt% of the fluorine resin.
|
