METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES
摘要
In an apparatus and method for treating a wafer-shaped article, a spin chuck is provided for holding a wafer-shaped article in a predetermined orientation wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A heating assembly comprising at least one infrared heater is mounted above the upper surface of the spin chuck and below a wafer-shaped article when mounted on the spin chuck. The heating assembly is stationary in relation to rotation of the spin chuck.
申请公布号
WO2013035020(A1)
申请公布日期
2013.03.14
申请号
WO2012IB54450
申请日期
2012.08.30
申请人
LAM RESEARCH AG;LAM RESEARCH CORPORATION;HOHENWARTER, KARL-HEINZ;LACH, OTTO