| 摘要 |
<p>Disclosed are a semiconductor package and a method of producing semiconductor package for increasing mass production while reducing a length of a wire used for wiring connection by forming a separate PCB on a semiconductor chip. The semiconductor package according to the present invention includes a semiconductor chip including a pin electrically connected with a pin of another semiconductor chip or a lead frame; and a PCB formed on the semiconductor chip and having a pattern formed of a metal material distinguished according to a position of the pin of the another semiconductor chip or the lead frame and a position of the pin of the semiconductor chip.</p> |
