JOINING METHOD AND JOINING SYSTEM

摘要

The present invention is a joining method that joins a substrate to be processed and a support substrate, wherein the method has: a joining step for pressing and joining the substrate to be processed and the support substrate with an adhesive therebetween; and then an adhesive elimination step for supplying a solvent of the adhesive to the outer adhesive that is the adhesive from between the substrate to be processed and the support substrate in the joining step protruding from the outer lateral surface of the stacked substrate resulting from joining the substrate to be processed and the support substrate, eliminating the surface of the outer adhesive in a manner so that the outer adhesive is formed at a predetermined size.