| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the heat resistance and the reliability of a chip type solid electrolytic capacitor. <P>SOLUTION: In a chip type solid electrolytic capacitor 100, a capacitor element 110 is formed by sequentially forming a porous sintered body 111, a dielectric layer 112, a solid electrolytic layer 113, and a cathode lead-out layer 114, and an electrode substrate 130 is formed by a laminated body of dissimilar metal materials. The laminated body of the dissimilar metal materials has, for example, a double layer structure composed of nickel or nickel alloy and copper or tin. Thus, heat stress in the electrode substrate 130 is relaxed during solder mounting and the leak current rise and the occurrence of mold cracks are reduced. <P>COPYRIGHT: (C)2013,JPO&INPIT |
