| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology which improves performance variations of an electromechanical conversion device having through wiring. <P>SOLUTION: A structure where an insulation portion 3 including through holes is joined to a conductive substrate 1 is obtained and the through holes are filled with a conductive material to form through wiring 4 electrically connecting with the conductive substrate 1. The conductive substrate 1 is used as a first electrode, and multiple vibration film parts 8, 9, 10, including a second electrode 9 which faces the first electrode, are formed on a side of the first electrode 1 which is opposite to the side, where the insulation portion 3 exists, through multiple gaps 7 to form multiple cells 11. An electromechanical conversion device is formed in these processes. <P>COPYRIGHT: (C)2013,JPO&INPIT |
