| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique which suppresses generation of a break of sealant for bonding two substrates, and can make a processing region to be punched provided in a bonded substrate smaller. <P>SOLUTION: A device body 51 beforehand heats a part, of a bonded film 43 placed on a placing table 53, including a processing region to be punched, using a heating head 52, and makes sealant included in the heated part harder. The heating is performed by making the heating head 52 fall toward the bonded film 43. After that, the device body 51 vertically moves a tool 51a so that a tip part of the tool 51a is inserted into a hole 53a of the placing table 53, and punches a hole in the heated part. The heating head 52 starts moving to a position of before movement while the tool 51a is vertically moved. <P>COPYRIGHT: (C)2013,JPO&INPIT |
