发明名称 |
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
A substrate is provided with a main surface having an off angle of 5° or smaller relative to a reference plane. The reference plane is a {000-1} plane in the case of hexagonal system and is a {111} plane in the case of cubic system. A silicon carbide layer is epitaxially formed on the main surface of the substrate. The silicon carbide layer is provided with a trench having first and second side walls opposite to each other. Each of the first and second side walls includes a channel region. Further, each of the first and second side walls substantially includes one of a {0-33-8} plane and a {01-1-4} plane in the case of the hexagonal system and substantially includes a {100} plane in the case of the cubic system.
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申请公布号 |
US2013062629(A1) |
申请公布日期 |
2013.03.14 |
申请号 |
US201213607388 |
申请日期 |
2012.09.07 |
申请人 |
HIYOSHI TORU;MASUDA TAKEYOSHI;WADA KEIJI;SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
HIYOSHI TORU;MASUDA TAKEYOSHI;WADA KEIJI |
分类号 |
H01L29/12;H01L21/20 |
主分类号 |
H01L29/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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