<p>The purpose of the present invention is to provide a composition for which problems do not arise during work even when heated, in a mounting step for an electronic device. This invention pertains to an underfill composition including a (meth) acrylic compound (a), a maleimide compound (b), and an isocyanuric acid having an aryl group (c).</p>
申请公布号
WO2013035205(A1)
申请公布日期
2013.03.14
申请号
WO2011JP70652
申请日期
2011.09.09
申请人
HENKEL AG & CO. KGAA;HORIGUCHI, YUSUKE;SANO, MIEKO;SATO, KENICHIRO
