JOINING METHOD, COMPUTER STORAGE MEDIUM, AND JOINING SYSTEM

摘要

This joining method for properly joining a substrate to be processed and a support substrate involves: an application step for applying an adhesive to the substrate to be processed or the support substrate; thereafter, a heat treatment step in which the surface of the adhesive on the substrate to be processed or the support substrate is heated to a prescribed temperature in a sealed treatment chamber with an oxygen-free atmosphere; and thereafter, a joining step in which the two substrates are joined by pressing.