| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor substrate and a manufacturing method of the same, which can increase the number of semiconductor chips capable of being manufactured from a laminated semiconductor wafer, and reduce a processing expense of the semiconductor wafer. <P>SOLUTION: A semiconductor wafer according to the present embodiment comprises a semiconductor substrate and a wiring layer formed on the semiconductor substrate. The semiconductor substrate includes a first region covered with the wiring layer and a second region formed on a periphery of the semiconductor substrate and not covered with the wiring layer. An insulation film is formed in the second region of the semiconductor substrate. A top face of the wiring layer and a top face of the insulation film are nearly on the same level. <P>COPYRIGHT: (C)2013,JPO&INPIT |
