| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sputtering apparatus which makes partial pressures of a reaction gas on a plurality of target surfaces be mutually equal and sputters each target with a mutually equal rate. <P>SOLUTION: The sputtering apparatus includes: a plurality of targets 21<SB POS="POST">1</SB>to 21<SB POS="POST">4</SB>which are arranged mutually apart in one line; and target devices 20<SB POS="POST">12</SB>, 20<SB POS="POST">34</SB>, wherein adjacent two targets 21<SB POS="POST">1</SB>to 21<SB POS="POST">4</SB>are set to be one set and a voltage is applied between one set of targets 21<SB POS="POST">1</SB>to 21<SB POS="POST">4</SB>. Each target device 20<SB POS="POST">12</SB>or 20<SB POS="POST">34</SB>includes: partition walls 23<SB POS="POST">1</SB>to 23<SB POS="POST">4</SB>which are arranged opposite to the side faces of one set of the targets 21<SB POS="POST">1</SB>to 21<SB POS="POST">4</SB>; gas introducing ports 28<SB POS="POST">1</SB>to 28<SB POS="POST">4</SB>provided between the partition walls 23<SB POS="POST">1</SB>to 23<SB POS="POST">4</SB>and the targets 21<SB POS="POST">1</SB>to 21<SB POS="POST">4</SB>; and main exhaust ports 25<SB POS="POST">12</SB>, 25<SB POS="POST">34</SB>which are provided on the bottom surface of a vacuum container 11. The reaction gas introduced from the gas introducing ports 28<SB POS="POST">1</SB>to 28<SB POS="POST">4</SB>is evacuated from the main exhaust ports 25<SB POS="POST">12</SB>, 25<SB POS="POST">34</SB>through between one set of the targets 21<SB POS="POST">1</SB>to 21<SB POS="POST">4</SB>. <P>COPYRIGHT: (C)2013,JPO&INPIT |
