| 摘要 |
<P>PROBLEM TO BE SOLVED: To wind a lead frame around a reel without curls in manufacturing a semiconductor device, while securing plate thickness of a lead so that a large amount of current can flow in the semiconductor device manufactured using the lead frame. <P>SOLUTION: A lead frame 1 comprises: a pair of rail plate parts 2A, 2B formed in a belt-like shape, and coupled with each other while they are parallely spaced from each other in a width direction; and plate-like leads 3A, 3B integrally extending from the respective rail plate parts 2A, 2B toward the other rail plate parts 2B, 2A opposed to them. Thickness of the rail plate parts 2A, 2B is set thinner than that of the leads 3A, 3B. Also, a base end 31 in an extension direction of each lead 3 is constituted by sequentially aligning a thin part 33 set to the same plate thickness as that of the rail plate part 2, and a thick part 34 with thickness larger than that of the thin part 33, and a step face 35 extending in the plate thickness direction of the lead 3 is formed between the thin part 33 and the thick part 34. <P>COPYRIGHT: (C)2013,JPO&INPIT |
