| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder alloy with enhanced joining strength despite a solder alloy having low Ag content. <P>SOLUTION: There is provided a solder alloy comprising, by weight, 0.1-1.0% Ag, 0.5-3.0% Cu, 0.005-0.5% an element selected from the group consisting of La, Ce, Pr, Nd, Sm and Yb, and the balance Sn with inevitable impurities. There is also provided the solder alloy comprising 0.1-1.0% Ag, 0.5-3.0% Cu, 0.005-0.1% an element selected from the group consisting of Y, Gd and Dy, and the balance Sn with inevitable impurities. The joining strength is considerably enhanced by adding the above elements of the prescribed concentrations to Sn which is a main component of the lead-free solder alloy while minimizing addition of the expensive Ag. <P>COPYRIGHT: (C)2013,JPO&INPIT |
