发明名称 |
Semiconductor Devices and Methods of Manufacturing and Packaging Thereof |
摘要 |
Semiconductor devices and methods of manufacturing and packaging thereof are disclosed. In one embodiment, a semiconductor device includes an integrated circuit and a plurality of copper pillars coupled to a surface of the integrated circuit. The plurality of copper pillars has an elongated shape. At least 50% of the plurality of copper pillars is arranged in a substantially centripetal orientation.
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申请公布号 |
US2013062741(A1) |
申请公布日期 |
2013.03.14 |
申请号 |
US201113228757 |
申请日期 |
2011.09.09 |
申请人 |
WU SHENG-YU;KUO TIN-HAO;CHEN CHEN-SHIEN;CHENG MING-DA;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WU SHENG-YU;KUO TIN-HAO;CHEN CHEN-SHIEN;CHENG MING-DA |
分类号 |
H01L23/495;H01L21/60;H01L21/98;H01L23/488 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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