发明名称 |
Microstructure Modification in Copper Interconnect Structures |
摘要 |
A metal interconnect structure and a method of manufacturing the metal interconnect structure. Manganese (Mn) is incorporated into a copper (Cu) interconnect structure in order to modify the microstructure to achieve bamboo-style grain boundaries in sub-90 nm technologies. Preferably, bamboo grains are separated at distances less than the Blech length so that copper (Cu) diffusion through grain boundaries is avoided. The added Mn also triggers the growth of Cu grains down to the bottom surface of the metal line so that a true bamboo microstructure reaching to the bottom surface is formed and the Cu diffusion mechanism along grain boundaries oriented along the length of the metal line is eliminated.
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申请公布号 |
US2013062769(A1) |
申请公布日期 |
2013.03.14 |
申请号 |
US201113232085 |
申请日期 |
2011.09.14 |
申请人 |
CABRAL, JR. CYRIL;NOGAMI TAKESHI;GAMBINO JEFFREY P.;HUANG QIANG;RODBELL KENNETH P.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CABRAL, JR. CYRIL;NOGAMI TAKESHI;GAMBINO JEFFREY P.;HUANG QIANG;RODBELL KENNETH P. |
分类号 |
H01L23/535;H01L21/768 |
主分类号 |
H01L23/535 |
代理机构 |
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代理人 |
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地址 |
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