DIE BONDER AND SEMICONDUCTOR MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a die bonder capable of reliably picking up a die, and provide a semiconductor manufacturing method.

SOLUTION: The die bonder or the semiconductor manufacturing method comprises: imaging dicing grooves surrounding dies on a wafer at a first illumination intensity to obtain first imaging data; detecting the dicing grooves from the first imaging data; performing rough positioning for setting a roughly positioned position of a predetermined position of the die; imaging the die at a second illumination intensity to obtain second imaging data; clipping a searching area from the second imaging data based on the roughly positioned position; matching the searching area with a predetermined template to set a definitely positioned position of the predetermined position; correcting a pickup position of a bonding head based on the definitely positioned position; and picking up the die from the wafer to bond the die to a substrate.

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