| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting diode device which reliably seals a light emitting diode element and easily and efficiently manufactures a light emitting diode device having excellent reliability. <P>SOLUTION: A laminated body 1, including a support layer 2, a restriction layer 3 formed on the support layer 2, and a sealing resin layer 5 formed on the restriction layer 3 and formed by a sealing resin, is prepared. The sealing resin layer 5 and the restriction layer 3 in the laminated body 1 is cut into patterns corresponding to light emitting diode elements 21 and an outer frame part 12 in the sealing resin layer 5 and the restriction layer 3 is removed. The sealing resin part 5 in each embedded part 10 is arranged so as to face the light emitting diode element 21, and the sealing resin part 5 in the embedded part 10 and the light emitting diode element 21 are pressed in a direction that those components are moved close to each other. Then, the light emitting diode element 21 is sealed by the sealing resin layer 5 and the support layer 2 and the restriction layer 3 are removed from the laminated body 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
