| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the uncharged state of a resin material in a cavity 10 and void formation at the outside and the inside of a resin package and to prevent resin leakage from an air vent groove 13 which makes the inside of the cavity 10 communicate with its outside when resin-sealing molding an electronic component on a substrate before resin-sealing, which is supplied and set in the cavity 10 of resin molding dies 5 and 8. <P>SOLUTION: Air vent pin attached plates 29 formed by attaching an air vent pin 28 at a position which becomes a position in the mold opening/closing direction of the resin molding die and at a position which is superposed on a molding pushing-out mechanism 17 are continuously disposed, and further the air vent pin 28 is disposed at the part of the air vent groove 13. The air vent groove 13 is set in an open state via the air vent pin 28 and further a resin material injection process into the cavity 10 and a decompression process in the cavity 10 are carried out in this open state, and further the air vent groove 13 is set in a closed state according to end time of the resin material injection process via the air vent pin 28. <P>COPYRIGHT: (C)2013,JPO&INPIT |
