| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure capable of reducing a degree of constriction of a bump occurring when a semiconductor substrate is flip-chip bonded and a force is applied to an outer edge or a central part of a mounting surface of the semiconductor substrate in a direction away from a mounting substrate, and provide a manufacturing method of the semiconductor device. <P>SOLUTION: A semiconductor device 100 comprises: a semiconductor substrate 102; an insulation layer 103 arranged to cover one surface 102a of the semiconductor substrate; a plurality of projections 109 provided on the insulation layer 103; and bump pads 106 separately provided to cover the projections 109, respectively; a plurality of bumps 107 formed on one surfaces 106a of the plurality of bump pads 106, respectively. The projections 109 have surfaces 109a contacting the bump pads 106 and individually tilting such that each of the one surfaces 106a of the plurality of bump pads 106 faces a center direction of the semiconductor substrate 102. <P>COPYRIGHT: (C)2013,JPO&INPIT |
