发明名称 |
MULTIPLE LAYER Z-AXIS INTERCONNECT APPARATUS AND METHOD OF USE |
摘要 |
A multiple layered apparatus and method for forming a z-axis interconnect is provided. The multiple layered apparatus comprises a protective layer, a dielectric layer, a conductive layer, and a support layer. A method for forming a z-axis interconnect using the multiple layer apparatus resulting in a thinner and less expensive structure for printed circuit board applications.
|
申请公布号 |
US2013062099(A1) |
申请公布日期 |
2013.03.14 |
申请号 |
US201213571229 |
申请日期 |
2012.08.09 |
申请人 |
HUNRATH CHRISTOPHER A.;CAC, INC. |
发明人 |
HUNRATH CHRISTOPHER A. |
分类号 |
H05K1/02;H01B13/00;H05K3/00 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|