发明名称 THERMALLY CONDUCTIVE THERMOPLASTIC RESIN COMPOSITIONS AND RELATED APPLICATIONS
摘要 Thermally conductive polymer compositions comprising polymer, highly moisture resistant magnesium oxide, and filler having higher aspect ratio than 5. The compositions are particularly useful for metal/polymer hybrid parts.
申请公布号 US2013062556(A1) 申请公布日期 2013.03.14
申请号 US201013383468 申请日期 2010.07.21
申请人 SAGA YUJI 发明人 SAGA YUJI
分类号 C09K5/00 主分类号 C09K5/00
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