| 摘要 |
A curable resin composition essentially includes an epoxy compound (A) having an oxycyclohexane skeleton including a cyclohexane ring and an epoxy group bound thereto through a single bond; an alicyclic epoxy compound (B) having two or more alicyclic epoxy groups per molecule; at least one bisphenol diepoxy compound (C) selected from bisphenol-A epoxy resins and bisphenol-F epoxy resins; a polyglycidyl ether of an aliphatic polyhydric alcohol (D); and a curing agent (E). The curable resin composition can give a cured article which has extremely superior moisture resistance, and, when used typically as an LED sealant, does not cause reduction in luminous flux even under hot and humid conditions. The cured article also has satisfactory cracking resistance and thermal stability in heat cycles. |
