发明名称 MOLD
摘要 <p>Provided is a technology that resolves defects such as cracking of a heat insulating layer resulting from the heat insulating layer formed at a first mold contacting a second mold at the mold mating surfaces. A mold is split into at least two pieces, a heat insulating layer is formed at approximately the entire inner wall surface, and the heat insulating layer is caused to not be present at the mating surfaces of the mold. For example, the mold is provided with a first mold constituting the majority of a cavity, and a second mold that forms at least a portion of the cavity together with the first mold; the first mold is provided with a flange section, and a portion of the surface of the flange section configures a portion of the mold mating surface.</p>
申请公布号 WO2013035625(A1) 申请公布日期 2013.03.14
申请号 WO2012JP72039 申请日期 2012.08.30
申请人 POLYPLASTICS CO., LTD.;MIYASHITA, TAKAYUKI;HIROTA, SHINICHI 发明人 MIYASHITA, TAKAYUKI;HIROTA, SHINICHI
分类号 B29C33/38;B29C45/26 主分类号 B29C33/38
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