发明名称 BARREL PLATING APPARATUS
摘要 PURPOSE: A barrel plating device is provided to uniform a plating thickness by changing speed of revolution, rotation velocity, and an angle of shaft of rotation of a barrel according to a determined plating profile. CONSTITUTION: A barrel plating device comprises a spinning table(10), a plurality of plating barrels(20), a rotation angle control unit(30), and a power source. The spinning table comprises a plurality of rotation shafts comprising an upper shaft, a lower shaft, and a universal joint(143) connecting the upper shaft and the lower shaft and rotates around a shaft of revolution. Plating barrels are connected to the upper shaft and forms a plating liquid accommodating unit inside. The plating barrels comprise an inlet(27) in which plating liquid flow and an outlet(24) which plating liquid is flown out. The plating barrels rotating around the upper shaft and makes a revolution around the shaft of the revolution. The rotation angle control unit pushes and pulls the upper shaft so that the upper shaft is inclined on an extension line of the lower shaft. The power source supplies current to anode dipped in the plating liquid accommodating unit and cathode inside the plating barrels.
申请公布号 KR20130026772(A) 申请公布日期 2013.03.14
申请号 KR20110090143 申请日期 2011.09.06
申请人 HUR, HYEOK JAE 发明人 HUR, HYEOK JAE
分类号 C25D17/18 主分类号 C25D17/18
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