发明名称 TRANSFER ROBOT, HOUSING, SEMICONDUCTOR MANUFACTURING DEVICE AND SORTER DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a transfer robot which can prevent the enlargement of a housing and the reduction of a cleaning degree, the housing, a semiconductor manufacturing method and a sorter device. <P>SOLUTION: A body of the transfer robot includes: a platy plate which is positioned so that its upper end is located below the lowest part of a first arm, and has a vertical face arranged with a fixing part for fixing the transfer robot so as to be vertical; an ascending/descending mechanism arranged at the vertical face; and a moving unit which rotatably supports the first arm and can ascend and descend on the vertical face by the ascending/descending mechanism. Furthermore, the lowest part of the first arm is made to approximate the body in such a degree that it does not contact with the upper end of the body. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013049133(A) 申请公布日期 2013.03.14
申请号 JP20120263147 申请日期 2012.11.30
申请人 YASKAWA ELECTRIC CORP 发明人 UMEZAKI TAKEHIRO;SHIMADA KATSUHIKO;YAMAMOTO HIDEO
分类号 B25J9/06;B65G49/06;B65G49/07;H01L21/677 主分类号 B25J9/06
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